| PART |
Description |
Maker |
| ICPL0601 ICPL0600 ICPL0611 |
DESCRIPTION
|
ISOCOM COMPONENTS
|
| PBSS4032PX |
General description
|
NXP Semiconductors
|
| 8XC251TP 8XC251SP 8XC251TA 8XC251SB 8XC251SQ 8XC25 |
Hardware Description
|
Intel Corporation
|
| STA-6033 |
Product Description
|
List of Unclassifed Manufacturers
Sirenza Microdevices
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| M14C32DD M14C32-DD |
M14C32 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| 05H12 |
General Description 一般描
|
List of Unclassifed Manufacturers
Motorola
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| BT132 |
TRANSISTOR
GENERAL DESCRIPTION
|
TY Semicondutor
TY Semiconductor Co., Ltd
|
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOTF12T50P |
TO220F PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOK50B60D1L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
